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SIPLACE and DEK deliver proof of innovation leadership, confirm growth strategy at Nepcon South China

Author: ComeFrom: Date:2014/9/4 12:19:12 Hits:646

Great success for ASM’s SMT Solutions Segment’s inaugural joint event

We will be the #1 supplier for SMT equipment solutions by 2016 – Günter Lauber

With its inaugural joint display at Nepcon South China 2014, the newly-created SMT Solutions Segment of ASM Pacific Technology Ltd. (ASMPT), consisting of printing specialist DEK and placement solutions expert SIPLACE, cemented its innovation leadership status within the electronics manufacturing industry, and also showcased the future potential of the merger. Best-in-class SMT placement and printing solutions included the SIPLACE X4i S, which is the fastest placement machine in the market and boasts a performance up to 150,000 components per hour (cph) with the new SIPLACE SpeedStar CP20 P placement head; and the DEK Horizon 03iX print platform along with the DEK Print Lab Solutions Center, which aims to improve output, lower operating costs and improve yield. All of these technologies and the collective expertise of the team served as proof of ASM Assembly Systems’ respective market leadership for both its Placement Solutions Division and its Printing Solutions Division and attracted countless visitors. SMT Solutions Segment CEO Günter Lauber is confident about the company’s outlook: “We will be the #1 supplier for SMT equipment solutions by 2016 – I have never been surer of this.”

DEK and SIPLACE have best-in-class solutions

After the acquisition of DEK by ASMPT became official on July 3, the Nepcon South China trade show marked the first occasion during which the SIPLACE and DEK teams had the opportunity to present their best-in-class solutions at a unified ASM Assembly Systems display. CEO Günter Lauber commented on the company’s strategy: “We are focused on growth in all directions. DEK and SIPLACE have best-in-class solutions and we will further improve on them. Beyond those efforts, however, we will also develop a new generation of SMT line solutions that deliver greater efficiency and process reliability through more effective integration of the printing, inspection and placement processes.”

SIPLACE: #1 in Speed, for Smallest Components and in Material Management

In terms of product innovations, the SIPLACE team highlighted three standouts from its product portfolio during Nepcon South China 2014. The four-gantry placement platform SIPLACE X4i S holds the current record for highest performance values: equipped with four of the new high-speed placement heads SIPLACE SpeedStar CP20 P, it reaches performance levels of up to 150,000cph. Visitors could also witness high-quality processing of smallest 03015 components live at the ASM Assembly Systems booth. Also a strong focus at Nepcon South China was the industry trend of smart automated factories: here, SIPLACE highlighted its intelligent suite for Material Management, in addition to other software tools.

DEK: #1 in Intelligent, Flexible Future-Proof Printing Technology

Highlighting the immense flexibility of the DEK Horizon 03iX platform, DEK printing specialists demonstrated the system’s adaptability to multiple manufacturing environments. From high-mix, low-volume to low-mix, high-volume operations, the DEK Horizon 03iX manages high speed and/or fast changeover with ease and minimal operator intervention. Six-Sigma machine alignment capability of greater than 2 Cpk @ +/-12.5 microns and cycle times as low as seven seconds put the platform at the top of its class for performance. Equipped with award-winning DEK technologies such as Cyclone understencil cleaning, automatic material management tools APD II and Paste Roll Height Monitor and Grid-Lok automatic board support – all which can be added on demand in the field -- the DEK Horizon 03iX on show punctuated the platform’s development philosophy that puts customer choice and manufacturing dynamics as priorities. In addition to live DEK Horizon 03iX demonstrations, show delegates learned more about the positive printing outcomes that can be achieved with advanced inputs such as DEK VectorGuard High Tension stencils and Ultra-Fine Pitch (UFP) Eco Roll understencil cleaning fabrics.

Next:Acquisition of DEK successfully completed – SIPLACE and DEK form ASMPT\'s SMT Solutions Segment
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